← Engineering Tools
PCB geometry · Signal integrity

Differential Pair Impedance Calculator

Estimate differential impedance from trace width, spacing, copper thickness, and stackup—or find a starting trace width for your target impedance.

Surface microstripSymmetric striplinemm / milDownload results
Start with the actual stackup.

Use this closed-form estimate to explore geometry. Confirm production dimensions with your PCB fabricator’s stackup model and impedance verification process.

Calculate your differential pair

Enter finished copper dimensions. Spacing S is the gap between the two trace edges, not their center-to-center pitch.

Geometry & target
Enter a trace width to estimate impedance. The target is a comparison reference, not a protocol preset.
One reference plane below the pair; no soldermask or nearby coplanar copper is included.
Use stackup Dk at the relevant frequency; 4.2 is an example, not a universal FR-4 value.
Same finished width for both traces.
Inside edge to inside edge.
From the trace underside to the upper surface of the reference plane. Not the total PCB thickness.
Thickness, not nominal foil weight. Always in µm.
Use the value specified for your interface.
A user-selected comparison band, not model accuracy or a guaranteed fabrication tolerance.

Screening window: W/H 0.1–2, S/H 0.2–5, T/H ≤ 0.25, εr 2–10. These are tool guardrails, not a validated accuracy range. Review the method and limits.

Calculated estimate

Select your geometry and calculate to see the result.

Your differential impedance, odd-mode impedance, and geometry summary will appear here.

A geometry estimate—not a channel sign-off

This tool does not model soldermask, etch shape, multiple dielectrics, frequency-dependent losses, vias, connectors, or skew. A result inside your selected band does not establish interface compliance or production yield.

Measure the right dimensions

Three details that change the answer

01 / GAP

Edge gap, not pitch

Enter the empty distance between the two traces as S. For equal widths, center-to-center pitch is W + S; the overall pair span is 2W + S. Do not enter either of these as the gap.

02 / STACKUP

H depends on the structure

For microstrip, H is the dielectric between the trace bottom and its plane. For this symmetric stripline model, H is the equal dielectric clearance on each side of the copper. Inner plane-to-plane distance is B = 2H + T.

03 / FABRICATION

Use finished geometry

Ask for the fabricated width, gap, copper thickness, dielectric build, and Dk convention. CAD width and starting foil weight may not describe the finished conductor cross-section.

Polar: finished-dimension definitions ↗

If the upper and lower clearances differ, do not average them into H. Use an asymmetric stripline model. Coplanar ground, embedded traces, and broadside pairs also require different structures. See Analog Devices’ transmission-line overview.
Transparent calculation method

Equations & screening limits

The calculator uses the closed-form expressions shown in Figure 9-4 of TI’s SN65MLVD203B datasheet, Rev. B. All lengths use the same units; ln is the natural logarithm. Output impedance is in ohms.

Edge-coupled microstrip

Equal surface traces, one reference plane, and air above the dielectric.

Z0 = 87 / √(εr + 1.41) × ln[5.98H / (0.8W + T)]
Zdiff = 2Z0 × [1 − 0.48 × exp(−0.96S/H)]

Symmetric edge-coupled stripline

Equal traces centered between two planes, with the same dielectric above and below.

Z0 = 60 / √εr × ln[1.9(2H + T) / (0.8W + T)]
Zdiff = 2Z0 × [1 − 0.347 × exp(−2.9S/H)]

What the width solver holds fixed

The solver changes W only. Edge gap S, height H, thickness T, dielectric constant, and topology remain fixed. It solves the same equation algebraically, then recalculates Zdiff before displaying the result.

Center-to-center pitch changes when W changes. If your layout fixes pitch instead of edge gap, this is not the correct constraint.

When the calculator stops

Accepted dimensions: W and S 0.005–10 mm, H 0.025–2 mm, and T 1–200 µm. Ratios must also satisfy W/H 0.1–2, S/H 0.2–5, and T/H ≤ 0.25; εr must be 2–10.

These are intentionally limited software guardrails, not a guarantee of equation accuracy. No result is extrapolated beyond them. The width solver reports the reachable target range when it cannot return a width inside this window.

For production work, use a structure-specific field solver with the fabricator’s finished stackup. Soldermask and multiple dielectric regions need explicit treatment; loss and dispersion require frequency-dependent analysis. Polar’s field-solver overview explains these model distinctions.
From estimate to a routable pair

What to check next

Impedance is one part of the interconnect. Match the next checks to the device, interface generation, and board construction.

STACKUP REVIEW

Confirm the build

  • Signal layer and adjacent reference planes.
  • Finished W, S, T, dielectric thickness, and material data.
  • Soldermask, etch profile, and fabrication limits.
  • Approved impedance target and acceptance method.
LAYOUT REVIEW

Check the entire route

  • Pair symmetry, uniform geometry, and allowed skew.
  • Continuous return paths across layer transitions.
  • Via stubs, breakout geometry, pads, and connectors.
  • Separation from other pairs and noise sources.

TI: high-speed layout guidance ↗

RELEASE REVIEW

Agree verification

  • Fabricator’s modeled dimensions and allowed tolerances.
  • Impedance coupon, TDR method, and reporting scope.
  • Channel loss, timing, and eye requirements when applicable.
  • Engineering approval before fabrication release.

Differential impedance questions

Is a 100 Ω differential pair two 50 Ω traces?

Each trace has 50 Ω odd-mode impedance in a symmetric 100 Ω pair. That is not necessarily the isolated single-ended impedance of either trace. Coupling between the traces changes the odd-mode result.

Should I change width or spacing first?

Start with the stackup and fabrication constraints. In this model, increasing W lowers Zdiff, while increasing S raises it toward the uncoupled limit. Use the width solver only when S can remain fixed, then review the resulting width and pitch against your layout rules.

Why is there no frequency input?

This is a quasi-static closed-form estimate, not a frequency-dependent channel model. Use an appropriate stackup Dk, then evaluate conductor and dielectric loss, dispersion, and interconnect discontinuities in a suitable solver for your signal bandwidth.

Does the microstrip result include soldermask?

No. It assumes air above the traces. If your pair is covered by soldermask, embedded in dielectric, or close to coplanar ground copper, use the matching coated, embedded, or coplanar model. There is no universal percentage correction applied here.

Can I use the total distance between stripline planes as H?

No. For this calculator, both trace-to-plane dielectric clearances equal H, excluding the trace thickness. If the inner plane-to-plane distance is B, enter H = (B − T) / 2, using the same units for B and T. This only applies to a centered trace layer.

Does “inside the selected band” mean the board will pass?

No. It only compares this calculation with your chosen target and percentage band. It does not include combined manufacturing variation, material variation, measurement uncertainty, or the rest of the channel. Agree the production model and verification requirements with your fabricator.

YURUNOX component sourcing

Need the components for your design?

Send the approved part numbers or BOM, quantities, package requirements, and delivery schedule. YURUNOX can review sourcing options for your interface ICs, connectors, protection devices, and supporting components.

Cart (0 items)