描述
98414-G06-10ULF Minitek® Header
2.00mm Fine Pitch meets Shrouded Latching Security – The Professional 10-Position Dual Row Shroud Choice for Mezzanine Board Interconnections.
// High-Density 2.00mm Matrix 10-Pin Through-Hole Profile
The High-Density Board Link Advantage
The 98414-G06-10ULF represents an industry-leading modular benchmark for high-density space-constrained board-to-board and board-to-wire signal distribution layouts. Engineered by Amphenol Commercial Products (FCI) under the prestigious Minitek® framework, this dual-row 10-pin shrouded header features premium gold-flash contact plating. Utilizing a highly efficient 2.00mm center grid allocation and high-temperature thermoplastic resin casing, it secures reliable, low-contact-resistance data bus pathways across multilayered backplanes.
- Dual-row 10-Pin shielded header footprint maximizing pitch spacing savings
- Fully-shrouded wall mechanism effectively locking out incorrect manual mating
- Through-hole wave solder leg anchors securing superior PCB mechanical retention
Key Performance Advantages
2.00mm Micro Pitch
Saves up to 38% real-estate space compared to legacy 2.54mm pin blocks, promoting significant layout optimization for advanced routing configurations.
Gold-Flash Contacts
Coated with robust gold layering to prevent localized contact pin tarnish, ensuring deterministic signal transits across frequent insertions.
Wave-Solder Compliant
Molded using premium high-temperature thermoplastic resins, retaining structural square pin coplanarity within intensive wave soldering profiles.
Technical Specifications
| Parameter Node | Detailed Engineering Specification |
|---|---|
| Manufacturer | Amphenol Commercial Products / ICC (FCI) |
| Part Number (MPN) | 98414-G06-10ULF |
| Product Series Family | Minitek® Modular System (Unshrouded / Shrouded Series) |
| Connector Orientation | Male Shrouded Header / Straight Vertical Mount |
| Number of Positions | 10 Pins Array (Dual-Row 5-Pin Per Grid) |
| Center Grid Pitch | 2.00 mm (0.079 inches) High-Density Allocation |
| Contact Plating Type | Gold-Flash over Nickel Underplate (Lead-Free RoHS Compliant) |
| Mounting Architecture | Through-Hole Soldering Tail (PCB Wave Solder Integration) |
| Current Rating Max | Up to 2.0 Amps Continuous per Contact Pin Block |
| Insulation Housing Resin | High-Temperature Black Thermoplastic (UL 94 V-0 Rated) |
Versatile Board Applications
- Telecommunications Backplanes: Core high-speed signal distribution linkages, mezzanine daughterboard cards, and router panels.
- Industrial Control Panels: Provides secure data bus connection bridges inside PLCs, variable-frequency drives, and IO modules.
- Automotive Avionics & Telemetry: Compact internal diagnostics instrumentation blocks and specialized GPS module interfaces.
- Consumer Device Assemblies: Clean inner wire-to-board routing layouts inside intelligent medical diagnostics monitors.
Industrial Quality Protections
100% Original Sourcing: Procured securely through fully audited tier-1 franchise lines, completely ensuring anti-counterfeit protection.
Anti-Static Handling: Stored and picked in full alignment with international ANSI/ESD cleanroom facility benchmarks.
Full Batch Traceability: Verified via intensive certificate analysis and rigorous documentation tracking prior to export dispatch.
HIGH-RELIABILITY BOARD-TO-BOARD INTERCONNECTS // DIRECT SOURCE ARCHITECTURE