描述
EP4SE360H29I3N Stratix IV FPGA
Ultra-Scale High-Density Core meets Low Latency – The Professional Stratix IV E Flagship FPGA Choice for High-Bandwidth Cloud Computing & Signal Matrix Processing.
// Massive 353.6K Logic Elements High-Performance Portfolio
The Flagship Ultra-Scale Advantage
The EP4SE360H29I3N stands as an elite benchmark for logic-intensive computing and massive parallel data distribution architectures. Engineered by Intel Altera on an advanced 40-nm high-performance silicon fabric, this Stratix IV E FPGA unifies an astronomical 353,600 flexible logic elements with a colossal 23.1 Mbit internal block RAM pool. Housed in a heavy-duty, multi-layer HBGA780 package footprint, it guarantees deterministic, jitter-free timing loops and wide bus bandwidth processing across 488 programmable user I/O ports under extreme EMI conditions.
- 353,600 High-performance Logic Cells (LEs) for heavy IP core pooling
- 488 User I/O pins optimized for high-speed multi-voltage level shifting
- On-chip hardware multipliers and global PLL networks ensuring strict data-strobing sync
Key Performance Advantages
353.6K LEs Monster Density
Houses a massive logic fabric capable of running extensive custom hardware algorithms, multiple processor soft cores, and high-density state structures simultaneously.
23.1Mb Colossal Block RAM
Integrates an astronomical on-chip memory block matrix, providing smooth ultra-deep dual-port buffering pipelines and large packet caching without data stalls.
Massive 488 User I/O
Expands hardware connectivity with 488 programmable pins, backed by high-speed global clock networks to secure deterministic tracking loops.
Technical Specifications
| Parameter Node | Detailed Engineering Specification |
|---|---|
| Manufacturer | Intel Altera |
| Part Number (MPN) | EP4SE360H29I3N |
| Device Family | Stratix IV E High-Density FPGA Series |
| Logic Elements (LEs) | 353,600 Logic Elements Matrix |
| Total Embedded RAM | 23,130 Kbits (23.1 Mb Internal Block RAM Matrix) |
| Number of LABs / CLBs | 14,144 Logic Array Blocks |
| Number of User I/Os | 488 Configurable User I/O Ports |
| Package / Case Form | HBGA-780 / H29 Footprint (Flip-Chip Ball Grid Array, Hybrid Matrix) |
| Speed / Timing Grade | -3 Speed Optimization Grade Rating (High-Speed Core) |
| Temperature Spectrum | Industrial Temperature Grade I Compliance (-40°C to +100°C) |
Versatile High-End Applications
- Telecommunications Backbone: Central switching hubs, cellular base stations, and high-frequency data framing networks.
- Cloud Server Centers: Acceleration platforms for heavy algorithmic processing, cloud computing data arrays, and network routing.
- Military & Aviation Computing: Complex real-time radar mapping, algorithmic simulation tracking, and deterministic logic arrays.
- Premium Medical Imaging: Real-time filtering matrices and data routing layers inside dense high-resolution MRI or CT scanners.
Industrial Quality Protections
100% Original Sourcing: Procured securely through fully audited tier-1 franchise lines, completely ensuring anti-counterfeit protection.
Anti-Static Handling: Stored and picked in full alignment with international ANSI/ESD cleanroom facility benchmarks.
Full Batch Traceability: Verified via intensive certificate analysis and rigorous documentation tracking prior to export dispatch.
HIGH-PERFORMANCE PROGRAMMABLE LOGIC SOLUTIONS // DIRECT SOURCE ARCHITECTURE