H25BFT8A1BMR

H25BFT8A1BMR

Premium SK Hynix H25BFT8A1BMR is a high-speed embedded UFS flash storage chip in a 153-FBGA package. Built with advanced multi-die V-NAND architecture, this hardware delivers deterministic data pipelines safely.

Info Product

SKU: H25BFT8A1BMR 品牌:

描述

H25BFT8A1BMR UFS Storage

High-Speed Multi-Lane Throughput meets Advanced V-NAND – The Professional Universal Flash Storage Choice for Premium AIoT Edge, Automotive Infotainment, and Smart Mobile Architectures.

// SK Hynix Premium Original Factory Sealed Allocation
// High-Density Non-Volatile Flash Cluster Space-Saving 153-FBGA Portfolio

The High-Bandwidth Next-Gen Embedded Storage Advantage

The H25BFT8A1BMR represents a premier professional embedded non-volatile solid-state Universal Flash Storage (UFS) solution engineered for space-constrained, high-throughput compute platforms demanding absolute read/write efficiency and multi-lane data routing interface profiles. Built on SK Hynix’s advanced multi-die silicon framework, this architecture processes parallelized data transmission loops and high-frequency read/write execution cycles flawlessly without I/O interface latency hazards or software execution bottlenecks. Housed in an industry-standard 153-FBGA package layout, it secures pure, deterministic code tracking loops and completely cuts off hardware memory degradation traps.

  • High-density non-volatile 3D flash memory matrix accommodating complex embedded system kernels and asset arrays
  • Advanced UFS serial interface architecture optimizing sequential data read speeds beyond legacy eMMC limitations safely
  • Integrated intelligent controller handling automated wear leveling, bad block maps, and ECC bit correction efficiently

H25BFT8A1BMR

Key Performance Advantages

High-Speed UFS Interface

Unlocks parallelized data read channels running on full-duplex serial interfaces, boosting active bandwidth and cutting boot latencies cleanly.

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Low Power Management

Utilizes optimized low-power voltage supply rails, massing suppressing parasitic power drain under deep standby cycles safely.

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153-FBGA Package

Housed inside a standard high-density fine-pitch ball grid array package, ensuring optimal space allocation with superb solder integrity smoothly.

Technical Specifications

Parameter Node Detailed Engineering Specification
Manufacturer SK Hynix Inc. (Original Factory Sealed Line Allocation)
Part Number (MPN) H25BFT8A1BMR
Memory Technology UFS (Universal Flash Storage Non-Volatile Solid State Framework)
Flash Architecture High-Density 3D V-NAND Flash Matrix Array Layout
Interface Connection High-Speed Serial Full-Duplex M-PHY Protocol Alignment
Integrated Controller SK Hynix In-house Flash Logic (Advanced Wear-leveling, Auto ECC, and Bad-block tracking)
Command Architecture SCSI Architecture Command Queuing extending parallelized resource execution
Operating Voltages Core Supply VCC / Interface VCCQ Nominal Dual Power Supply Matrix
Package / Case Form 153-FBGA package (153-Ball Fine-Pitch Ball Grid Array Matrix Layout)
Component Status Production Quality Grade Active Commercial Hardware Portfolio

Versatile High-Speed Embedded Applications

  • Automotive IVI Systems: Primary high-capacity storage block driving smart digital cockpits, real-time navigation mapping, and multimedia dashboard links safely.
  • Industrial AIoT Gateways: Delivers deterministic internal OS storage and continuous database caching inside complex industrial edge hubs smoothly.
  • Advanced Smart Displays: Handles demanding high-resolution video buffering, local application assets, and commercial matrix rendering cleanly.
  • Embedded Computing Modules: Optimizes long-term data retention and rapid boot execution paths inside portable medical diagnostic gear.

Industrial Quality Protections

100% Original Sourcing: Procured securely through fully audited tier-1 franchise lines, completely ensuring anti-counterfeit protection.

Anti-Static Handling: Stored and picked in full alignment with international ANSI/ESD cleanroom facility benchmarks.

Full Batch Traceability: Verified via intensive certificate analysis and rigorous documentation tracking prior to export dispatch.

HIGH-PERFORMANCE UNIVERSAL FLASH STORAGE SOLUTIONS // DIRECT SOURCE ARCHITECTURE

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