H9HCNNNBPUMLHR

H9HCNNNBPUMLHR

Premium SK Hynix H9HCNNNBPUMLHR is a 16Gb LPDDR4X memory chip in a 200-FBGA package. Featuring 4266Mbps speed, dual-channel layout, and ultra-low voltage, this hardware delivers deterministic data pipelines safely.

Info Product

SKU: H9HCNNNBPUMLHR 品牌:

描述

H9HCNNNBPUMLHR LPDDR4X

4266Mbps Ultra-High Speed meets Next-Gen Power Efficiency – The Professional 16Gb LPDDR4X Memory Choice for AIoT Edge Hardware, Premium Mobile Platforms, and Automotive Smart Systems.

// SK Hynix Premium Original Factory Sealed Allocation
// Ultra-Low Power I/O Core Component Dual-Channel 200-FBGA Portfolio

The Low-Power High-Bandwidth Memory Advantage

The H9HCNNNBPUMLHR represents a premier professional 16Gb LPDDR4X SDRAM low-power mobile memory solution engineered for space-constrained, battery-reliant computing hardware architectures demanding absolute signal processing efficiency and maximized bandwidth profiles. Built on SK Hynix’s advanced low-power silicon framework, this module processes high-frequency data transmission up to 4266Mbps data rates flawlessly without system latency hazards or thermal throttling bottlenecks. Housed in an industry-standard 200-FBGA package footprint, it secures pure, deterministic high-speed data tracking execution loops and completely cuts off systemic power bus transmission barriers.

  • Massive 16 Gigabits (16Gb / 2 Gigabytes) density providing extensive high-speed workspace for complex operational firmware
  • Advanced LPDDR4X standard reducing VDDQ voltage rails down to 0.6V, saving vital energy under standby cycles safely
  • Optimized dual-channel multi-bank architecture maximizing peak system throughput parameters cleanly

H9HCNNNBPUMLHR

Key Performance Advantages

4266Mbps Throughput

Unlocks ultra-high frequency processing paths, perfect for intensive edge AI data processing, real-time computer vision, and high-definition video streams cleanly.

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0.6V Ultra-Low I/O VDDQ

Reduces interface I/O operating voltage levels to 0.6V (vs 1.1V in LPDDR4), massively suppressing parasitic power drain and thermal dissipation safely.

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200-FBGA SMT Packaging

Leverages an ultra-compact fine-pitch ball grid array layout, maximizing integration density on premium multi-layer printed circuit boards smoothly.

Technical Specifications

Parameter Node Detailed Engineering Specification
Manufacturer SK Hynix (Original Factory Sealed Allocation)
Part Number (MPN) H9HCNNNBPUMLHR (LPDDR4X Product Framework)
Memory Technology LPDDR4X SDRAM (Low Power Double Data Rate 4X Synchronous DRAM)
Density Capacity 16 Gigabits / 2 Gigabytes (High-Density Monolithic Core Array)
Maximum Data Rate Up to 4266 Mbps Ultra-High Frequency Data Transmission Speed Node
Channel Architecture Integrated Dual-Channel Layout Matrix for parallelized pipeline resource scaling
Operating Voltages VDD1 = 1.8V / VDD2 = 1.1V / VDDQ = 0.6V (Next-Gen Power Configuration)
Package / Case Form 200-FBGA package (200-Ball Fine-Pitch Ball Grid Array Form Factor Layout)
Packaging Profile Standard JEDEC Compliant Tape & Reel SMT Automated Allocation
Component Status Production Quality Grade Active Commercial Hardware Portfolio

Versatile Low-Power Memory Applications

  • Automotive Infotainment: Core memory block driving digital smart cockpits, advanced navigation systems, and real-time ADAS tracking pipelines safely.
  • Industrial Edge AIoT: Delivers deterministic internal memory workspace and rapid data caching inside high-speed computing modules and gateways smoothly.
  • Premium Smart Handhelds: Handles demanding local calculations, biometric telemetry scanning, and advanced compact communication units cleanly.
  • Single Board Compute Systems: Optimizes operational thermal thresholds inside miniaturized high-reliability edge nodes and instrumentation panels.

Industrial Quality Protections

100% Original Sourcing: Procured securely through fully audited tier-1 franchise lines, completely ensuring anti-counterfeit protection.

Anti-Static Handling: Stored and picked in full alignment with international ANSI/ESD cleanroom facility benchmarks.

Full Batch Traceability: Verified via intensive certificate analysis and rigorous documentation tracking prior to export dispatch.

HIGH-PERFORMANCE LPDDR4X SDRAM SOLUTIONS // DIRECT SOURCE ARCHITECTURE

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