KLMDG8JENB-B041

KLMDG8JENB-B041

Premium Samsung KLMDG8JENB-B041 is a 128GB eMMC 5.1 storage chip in a 153-FBGA package. Operating at high speeds with multi-die architecture, this hardware delivers deterministic data pipelines safely.

Info Product

SKU: KLMDG8JENB-B041 品牌:

描述

KLMDG8JENB-B041 eMMC 5.1

128GB High Capacity meets HS400 Speed Mode – The Professional eMMC 5.1 Embedded Storage Choice for Automotive, Industrial IoT, and Smart Mobile Architectures.

// Samsung Semiconductor Premium Original Factory Sealed Allocation
// High-Density Flash Memory Solution Core HS400 153-FBGA Portfolio

The High-Density Advanced eMMC Advantage

The KLMDG8JENB-B041 represents a premier professional embedded mass storage solution engineered for space-constrained, high-throughput operating systems demanding absolute data retention efficiency and rapid data access bus profiles. Built on Samsung’s advanced multi-die Flash architecture and implementing the industry-standard eMMC 5.1 interface protocol, this system processes high-frequency read/write execution loops up to HS400 speed nodes flawlessly without system latency hazards. Housed in a standard 153-FBGA package layout, it secures pure, deterministic software safety execution and completely cuts off hardware memory degradation bottlenecks.

  • Massive 128 Gigabytes (128GB) onboard storage capacity accommodating heavy firmware and complex database matrices
  • Advanced eMMC 5.1 command queuing features optimizing system multitasking and booting cycles safely
  • Integrated internal controller handling wear leveling, bad block management, and ECC error routines efficiently

KLMDG8JENB-B041

Key Performance Advantages

HS400 High Speed Mode

Utilizes 8-bit bus widths operating at 200MHz double data rates, boosting overall system bandwidth and sequential file processing cleanly.

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128GB Dense Storage

Supplies reliable, vast on-chip non-volatile flash memory space, allowing ample room for complex applications and automated continuous data logging safely.

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153-FBGA Matrix Package

Housed inside a standard high-density fine-pitch ball grid array, minimizing required PCB footprint area while boosting connection stability smoothly.

Technical Specifications

Parameter Node Detailed Engineering Specification
Manufacturer Samsung Semiconductor (Original Factory Sealed Allocation)
Part Number (MPN) KLMDG8JENB-B041 (eMMC 5.1 Product Matrix)
Memory Technology eMMC 5.1 (Embedded MultiMediaCard Non-Volatile Flash System)
Storage Capacity 128 Gigabytes (128GB High-Density NAND Flash Cluster)
Bus Performance Mode HS400 (High-Speed Dual Data Rate up to 400 MB/s Maximum Throughput)
Operating Voltages VCC 3.3V (NAND Flash Core) / VCCQ 1.8V or 3.3V (Controller Interface Bus)
Integrated Flash Controller Built-in Smart NAND Management (Auto ECC, Wear-Leveling, and Garbage Collection)
Package / Case Form 153-FBGA package (153-Ball Fine-Pitch Ball Grid Array Form Factor Layout)
Packaging Profile Standard JEDEC Compliant Layout for High-Speed SMT Placement Systems
Component Status Production Quality Grade Active Commercial Hardware Portfolio

Versatile High-Density Embedded Applications

  • Automotive Infotainment: Core non-volatile storage block driving dashboard maps, media systems, and local telemetry logging safely.
  • Industrial Gateway Computers: Delivers deterministic internal OS storage and continuous database caching inside edge computing hubs smoothly.
  • Smart Displays & Signage: Handles demanding local video buffering, firmware assets, and high-definition multi-media rendering cleanly.
  • Medical Diagnostic Systems: Optimizes long-term data retention and high-speed data recall parameters inside complex portable scanning gear.

Industrial Quality Protections

100% Original Sourcing: Procured securely through fully audited tier-1 franchise lines, completely ensuring anti-counterfeit protection.

Anti-Static Handling: Stored and picked in full alignment with international ANSI/ESD cleanroom facility benchmarks.

Full Batch Traceability: Verified via intensive certificate analysis and rigorous documentation tracking prior to export dispatch.

HIGH-PERFORMANCE EMMC 5.1 STORAGE SOLUTIONS // DIRECT SOURCE ARCHITECTURE

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