KLUEG8UHDB-C2D1

KLUEG8UHDB-C2D1

Premium Samsung KLUEG8UHDB-C2D1 is a 256GB UFS 2.1 storage chip in a 153-FBGA package. Featuring dual-lane high bandwidth, multi-die architectures, and low power, this framework delivers deterministic data pipelines safely.

Info Product

SKU: KLUEG8UHDB-C2D1 品牌:

描述

KLUEG8UHDB-C2D1 UFS 2.1

256GB Massive Capacity meets UFS 2.1 Dual-Lane Gear 3 – The Professional High-Speed Universal Flash Storage Choice for Premium Edge computing, Automotive In-Vehicle Infotainment, and AIoT Gateways.

// Samsung Semiconductor Premium Original Factory Sealed Allocation
// High-Density Non-Volatile Flash Cluster Dual-Lane Interface 153-FBGA Portfolio

The High-Bandwidth Next-Gen Storage Advantage

The KLUEG8UHDB-C2D1 represents a premier professional embedded non-volatile solid-state storage solution engineered for space-constrained, high-throughput compute platforms demanding absolute read/write efficiency and multi-lane data routing interface profiles. Built on Samsung’s advanced multi-die V-NAND Flash framework and utilizing the advanced Universal Flash Storage (UFS) 2.1 standard with SCSI Architecture Command Queuing, this system processes parallelized data transmission loops flawlessly without I/O interface latency hazards or software execution bottlenecks. Housed in an industry-standard 153-FBGA package layout, it secures pure, deterministic code tracking loops and completely cuts off hardware memory degradation traps.

  • Massive 256 Gigabytes (256GB) continuous silicon density accommodating complex system kernels and asset arrays
  • UFS 2.1 Dual-Lane infrastructure optimizing sequential read speeds beyond legacy eMMC limitations safely
  • Integrated intelligent controller handling automated wear leveling, bad block maps, and ECC bit correction efficiently

KLUEG8UHDB-C2D1

Key Performance Advantages

Dual-Lane High Speed

Unlocks parallelized data read channels running on full duplex M-PHY interfaces, boosting read speeds drastically compared to standard single-wire links cleanly.

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256GB Massive Storage

Supplies vast, non-volatile memory block density, providing generous space for rich graphical maps, media analytics, and data caching safely.

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153-FBGA Matrix Package

Housed inside a standard high-density fine-pitch ball grid array package, ensuring optimal space allocation with superb solder integrity smoothly.

Technical Specifications

Parameter Node Detailed Engineering Specification
Manufacturer Samsung Semiconductor (Original Factory Sealed Line)
Part Number (MPN) KLUEG8UHDB-C2D1
Memory Technology UFS 2.1 (Universal Flash Storage Solid State Framework)
Storage Capacity 256 Gigabytes (256GB Non-Volatile V-NAND Cluster)
Bus Interface Mode Dual-Lane High-Speed Interface (Full Duplex M-PHY Protocol Alignment)
Command Architecture SCSI Architecture Command Queuing (Extending multitasking throughput loops)
Integrated Controller Samsung In-house Flash Logic (Advanced Wear-leveling, Auto ECC, and Bad-block tracking)
Package / Case Form 153-FBGA package (153-Ball Fine-Pitch Ball Grid Array Matrix Layout)
Operating Voltages Core VCC / Interface VCCQ Nominal Dual Power Supply Framework
Component Status Production Quality Grade Active Commercial Hardware Allocation

Versatile High-Speed Embedded Applications

  • Automotive IVI Systems: Primary high-capacity storage block driving smart digital cockpits, real-time navigation mapping, and multimedia dashboard links safely.
  • Industrial AIoT Gateways: Delivers deterministic internal OS storage and continuous database caching inside complex industrial edge hubs smoothly.
  • Advanced Smart Displays: Handles demanding 4K video buffering, local application assets, and high-definition commercial matrix rendering cleanly.
  • Embedded Computing Modules: Optimizes long-term data retention and rapid boot execution paths inside portable medical diagnostic gear.

Industrial Quality Protections

100% Original Sourcing: Procured securely through fully audited tier-1 franchise lines, completely ensuring anti-counterfeit protection.

Anti-Static Handling: Stored and picked in full alignment with international ANSI/ESD cleanroom facility benchmarks.

Full Batch Traceability: Verified via intensive certificate analysis and rigorous documentation tracking prior to export dispatch.

HIGH-PERFORMANCE UFS 2.1 STORAGE SOLUTIONS // DIRECT SOURCE ARCHITECTURE

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