描述
PEX8747-BA80FBCG PCIe Gen3 Switch
48-Lane 5-Port High-Speed Fabric meets Ultra-Low Latency – The Professional PCIe Switch Express Lane Choice for AI Scaling & Multi-GPU Clusters.
// High-Performance 8.0 GT/s Throughput Multi-Host HFCBGA Portfolio
The High-Speed PCIe Fabric Architecture Advantage
The PEX8747-BA80FBCG represents a premier flagship modular solution for space-constrained, high-performance computing (HPC) server blades demanding absolute data routing integrity and multi-host interconnectivity. Engineered by PLX Technology (Broadcom Limited), this 48-lane, 5-port PCI Express Gen 3 switch IC orchestrates complex parallel computations and high-bandwidth graphic matrices flawlessly. Housed in a robust Flip-Chip BGA packaging footprint, it secures pure, deterministic data routing paths and eliminates systemic processing bottleneck hazards.
- 48-Lane 5-Port highly flexible line configuration matrix handling diverse link splittings
- PCI Express Gen3 architecture delivering a massive raw speed of 8.0 GT/s per lane
- Integrated multi-host bridging features supporting independent host system handshakes
Key Performance Advantages
Ultra-Low Latency
Utilizes an optimized cut-through packet-forwarding engine, driving data delay metrics down to sub-130ns to fulfill strict real-time AI training requirements.
Multi-Host Topology
Backs highly reliable Non-Transparent Bridging (NTB) structures, allowing safe multi-host failover mappings and fast data exchange redundancy loops.
Advanced DMA Engine
Integrates custom high-speed direct memory access channels, accelerating data replication procedures while freeing up host CPU processing load margins.
Technical Specifications
| Parameter Node | Detailed Engineering Specification |
|---|---|
| Manufacturer | Broadcom Limited / PLX Technology |
| Part Number (MPN) | PEX8747-BA80FBCG |
| Product Category | High-Performance PCI Express Gen 3 Switch ICs |
| Total Lanes Array | 48 PCI Express Lanes Structure |
| Port Configurations | 5 Flexible Bidirectional Network Ports |
| Data Transfer Speed | 8.0 GT/s (Gigatransfers Per Second per Lane) Gen3 Pattern |
| Packet Forwarding Latency | Typical 126 ns Low Delay Architecture |
| Bridging Protocols | Supports Standard Transparent & Non-Transparent Bridging (NTB) |
| Package / Case Form | HFCBGA / BGA Layout Package (Flip-Chip Ball Grid Array, Lead-Free/RoHS Compliant) |
| Temperature Window | Standard Performance Commercial Operating Spectrum (0°C to +70°C) |
Versatile Fabric Applications
- AI Deep Learning Servers: High-density multi-GPU expansion fabrics, organizing dynamic computing tasks across NVIDIA / AMD matrix setups.
- High-End Graphic Workstations: Orchestrates robust cluster line splitting pipelines, backing smooth 3D rendering and simulation tasks.
- Enterprise Storage Arrays: Provides high-speed data interconnect pathways for massive NVMe SSD storage host array systems.
- Industrial Test Equipment: High-bandwidth PCIe backbone linkages connecting microprocessors directly to complex measurement boards.
Industrial Quality Protections
100% Original Sourcing: Procured securely through fully audited tier-1 franchise lines, completely ensuring anti-counterfeit protection.
Anti-Static Handling: Stored and picked in full alignment with international ANSI/ESD cleanroom facility benchmarks.
Full Batch Traceability: Verified via intensive certificate analysis and rigorous documentation tracking prior to export dispatch.
HIGH-PERFORMANCE INTERCONNECT ARCHITECTURE // DIRECT SOURCE FACTORY