MT29F4G08ABADAWP-IT:D

MT29F4G08ABADAWP-IT:D

Premium Micron MT29F4G08ABADAWP-IT:D is an industrial-grade 4Gb SLC NAND Flash chip housed in a 48-pin TSOP package. Featuring an x8 organization matrix, a low 3.3V power rail, and an extended industrial temperature window, this rugged device delivers deterministic non-volatile storage pipelines required for high-reliability embedded computing frameworks.

Info Product

SKU: MT29F4G08ABADAWP-IT:D 品牌:

描述

MT29F4G08ABADAWP-IT:D NAND Flash

4Gb Storage Density meets Industrial IT Rating – The Professional High-Reliability SLC NAND Choice for Embedded Systems.

// Micron Technology Premium Original Factory Sealed Allocation
// Single-Level Cell (SLC) Technology Extended Temperature 48-Pin TSOP Portfolio

The Industrial Non-Volatile Storage Advantage

The MT29F4G08ABADAWP-IT:D represents a premier flagship single-chip non-volatile storage solution for space-constrained, harsh industrial hardware architectures demanding absolute write endurance and boot-code execution stability. Engineered by Micron Technology inside their high-endurance SLC NAND silicon framework, this 4-Gigabit memory module handles fast block erase and page program cycles flawlessly under extreme thermal swings. Housed in a standard through-hole surface-mount 48-pin TSOP package footprint, it secures pure, deterministic code telemetry loops and completely cuts off systemic storage corruption hazards.

  • 4 Megabit dense storage core structured inside a highly reliable x8 parallel organization matrix
  • Single-Level Cell (SLC) engineering providing superior block endurance over standard MLC products
  • Standard 3.3V operational VCC rail securing clean hardware integration on modern controller boards

MT29F4G08ABADAWP-IT:D

Key Performance Advantages

🛡️

High-Endurance SLC

Leverages robust single-level cell flash technology, delivering exceptional program/erase cycle life parameters required for critical industrial firmware storage arrays.

❄️

Industrial IT Grade

Formally designated with extended “IT” qualification bounds, fully safeguarding solid state data retention performance inside harsh thermal operating windows.

📐

TSOP-48 Form Factor

Housed in a standard through-hole surface-mount 48-pin TSOP Type 1 package outline, ensuring seamless pin-to-pin layout migration and simplified solder tracking inspection.

Technical Specifications

Parameter Node Detailed Engineering Specification
Manufacturer Micron Technology Inc.
Part Number (MPN) MT29F4G08ABADAWP-IT:D
Memory Type SLC NAND Flash (Single-Level Cell Non-Volatile Memory)
Storage Density 4 Gigabit (4Gb Array Configured inside an x8 Bit Parallel Structure)
Operational Voltage (Vcc) 3.3 VDC Standard Nominal Driving Power Specification Range
Interface Type Open NAND Flash Interface (ONFI) compliant parallel bus corridors
Die Generation Revision Micron D-Die Silicon Core Platform Modulator Architecture
Component Status Production Quality Grade Active Commercial Inventory Profile
Package / Case Form TSOP-48 / TSOP I Package (Lead-Free SMT Solder Construction, Code: WP)
Temperature Window Extended Industrial Performance Operating Range (-40°C to +85°C)

Versatile Solid State Applications

  • Embedded Controllers: Foundational boot code and operating system image storage node inside rugged programmable logic controllers (PLCs).
  • Network Equipment: Reliable system log storage and recovery parameter cache arrays used across industrial-grade switches and routers.
  • Automotive Interfaces: Stable code execution media managing dashboard telemetry pipelines and smart infotainment hardware.
  • IoT Gateway Platforms: Secures consistent non-volatile data routing pathways required for edge computing sensor boxes.

Industrial Quality Protections

100% Original Sourcing: Procured securely through fully audited tier-1 franchise lines, completely ensuring anti-counterfeit protection.

Anti-Static Handling: Stored and picked in full alignment with international ANSI/ESD cleanroom facility benchmarks.

Full Batch Traceability: Verified via intensive certificate analysis and rigorous documentation tracking prior to export dispatch.

HIGH-ENDURANCE SLC NAND FLASH SOLUTIONS // DIRECT SOURCE ARCHITECTURE

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