Infineon Power, Automotive, and Embedded Solutions.
YURUNOX helps engineering and procurement teams connect power conversion, motor drives, automotive control, embedded computing, memory, USB, wireless, sensing, and security requirements with suitable Infineon product families, then review the exact ordering code, electrical and thermal fit, lifecycle, supply condition, evidence, and delivery terms.
Search the Exact Infineon OPN.
Search Infineon, Cypress, or International Rectifier part numbers and product-family keywords.
Review topology, voltage, current, switching, losses, driver, protection, cooling, package, and lifetime.
Define the ECU, safety and security context, networking, sensing, power stage, temperature, and qualification.
Confirm CPU, memory, analog, timers, motor control, connectivity, security, software, package, and lifecycle.
Review flash, SRAM, USB, Wi-Fi, Bluetooth, Ethernet, sensors, security, interface, and software needs.
Start With What Your System Must Do.
Begin with the function, not a product name. Voltage, current, workload, interfaces, safety, software, package, qualification, and lifecycle determine the suitable Infineon direction.
Select the Right Power Switch or Module
Define topology, bus voltage, current and surge, switching frequency, hard or soft switching, conduction and switching losses, gate drive, short-circuit behavior, isolation, cooling, mechanical mounting, and lifetime.
Build the Automotive ECU Platform
Confirm the vehicle function, workload, safety and cybersecurity context, CAN or Ethernet, memory, sensors, supply and driver needs, thermal environment, package, qualification, software, and lifecycle.
Choose an Embedded Controller
Review CPU and memory, programmable analog, timers, motor-control functions, USB, Ethernet or wireless, security, low-power modes, RTOS and middleware, toolchain, package, and production life.
Add Memory, Connectivity, and Security
Define density, interface, bandwidth, endurance, retention, voltage, package, temperature, boot and execute-in-place needs, USB or wireless standard, host software, security model, qualification, and lifecycle.
Find the Right Infineon Product Family.
Match the family to the required function first. Then confirm the exact ordering code, ratings, package, qualification, lifecycle, software, quantity, and actual supply condition.
OptiMOS™ Low-Voltage MOSFETs
Silicon MOSFET direction for synchronous rectification, DC-DC conversion, battery systems, motor drives, servers, telecom, and high-current low-voltage rails.
View OptiMOS ProductsCoolMOS™, CoolSiC™, and CoolGaN™
High-voltage power-device directions for PFC, resonant conversion, solar, energy storage, industrial power supplies, telecom, servers, charging, and onboard power.
View High-Voltage MOSFETIGBT Discretes and Modules
Power-switching direction for industrial drives, traction, renewable energy, UPS, welding, HVAC, elevators, and high-power inverter systems.
View IGBT ModulesGate Drivers and Power Management
EiceDRIVER™, OPTIREG™, DC-DC, PMIC, battery-management, motor-driver, protection, isolation, and control directions selected around the power device.
Review a Power StageAURIX™, TRAVEO™, and MOTIX™
Automotive and motor-control directions for powertrain, chassis, body, gateway, zone control, safety, security, electrification, actuation, and diagnostics.
Review Automotive ControlPSOC™ and XMC™ MCUs
Programmable and industrial MCU directions for IoT, consumer, HMI, sensing, motor control, digital power, automation, and connected embedded systems.
Review Embedded ControlMemory and Connectivity
NOR flash, F-RAM, SRAM, USB, Wi-Fi, Bluetooth, Ethernet, and related software directions for boot, data, interface, and connected-product requirements.
View Memory ProductsSensors and Hardware Security
XENSIV™ sensing and OPTIGA™ security directions for current, magnetic, pressure, radar, audio, presence, identity, authentication, and protected connected systems.
Explore System ApplicationsStart With Frequently Requested Infineon Parts.
Use these representative power, MOSFET, memory, and USB products as direct entry points. Confirm the complete ordering code and actual order conditions before purchasing.
IGBT POWER MODULEFF450R12ME4
Power-module direction for industrial inverters, motor drives, and energy conversion.
LOW-VOLTAGE MOSFETBSC014N04LS6
OptiMOS™ direction for synchronous rectification and compact high-current power rails.
SPI NOR FLASHS25FL128SAGMFI011
FL-S memory direction for embedded boot, code storage, and connected equipment.
EZ-USB™ FX2LPCY7C68013A-56LTXC
Legacy USB 2.0 controller direction for maintenance of validated released systems.
Match Your Application to an Infineon Direction.
Choose the application and main function. The result gives a starting product direction and the technical and purchasing details to confirm next.
Define the Application and Main Function.
Start with what the system must switch, convert, control, store, connect, sense, or protect. The exact part can then be narrowed by electrical and thermal limits, performance, software, package, qualification, lifecycle, and supply requirements.
The result is an initial family direction, not a substitute for system architecture, software compatibility, circuit design, prototype validation, safety, cybersecurity, compliance, or engineering approval.
Infineon Power Module Direction
Begin with topology, DC-link voltage, continuous and peak current, switching frequency, modulation, overload, short-circuit behavior, gate driver, isolation, cooling, mounting, lifetime, and qualification.
Compare Infineon Parts by Function and Design Risk.
Compare inverter, power-supply, automotive, memory, USB, and legacy-platform directions before reviewing an exact ordering code.
| Product | Family / Category | Primary Direction | Package / Status Context | Key Selection Checks | Product Page |
|---|---|---|---|---|---|
| FF450R12ME4 | EconoDUAL™ 3 IGBT Module | High-power industrial inverter, motor-drive, renewable-energy, and converter direction. | 1200 V / 450 A module context | Topology, DC link, RMS and peak current, switching, losses, driver, isolation, short circuit, cooling, mounting, and lifetime. | View FF450R12ME4 |
| BSC014N04LS6 | Low-Voltage Power MOSFET | High-current low-voltage switching and synchronous-rectification direction. | Exact ordering-code review required | Complete OPN, VDS, current, RDS(on), gate charge, drive voltage, switching, SOA, thermal path, package, and PCB layout. | View BSC014N04LS6 |
| S25FL128SAGMFI011 | FL-S SPI NOR Flash | Boot, code, execute-in-place, and nonvolatile data-storage direction. | 128 Mbit; SOIC-16 family context | Density, SPI modes, frequency, voltage, temperature, endurance, retention, sector architecture, package, software, and lifecycle. | View S25FL128SAGMFI011 |
| CY7C68013A-56LTXC | EZ-USB™ FX2LP Controller | Legacy high-speed USB 2.0 peripheral-controller direction. | 56-pin QFN; discontinued lifecycle | USB speed, FIFO and GPIF behavior, 8051 firmware, host driver, voltage, temperature, package, lifecycle, replacement, and validation. | View CY7C68013A-56LTXC |
| FP25R12W1T4 | EasyPIM™ IGBT Module | Compact motor-drive and industrial power-conversion direction. | 1200 V / 25 A module context | Rectifier and inverter topology, DC link, motor current, brake function, switching, driver, protection, cooling, package, and lifecycle. | View FP25R12W1T4 |
| IRFB7430PBF | StrongIRFET™ MOSFET | Low-frequency high-current switching for motors, batteries, inverters, and DC-DC systems. | 40 V TO-220; not for new design | Current, RDS(on), drive, switching frequency, SOA, pulse and avalanche needs, thermal path, mounting, lifecycle, and replacement. | View IRFB7430PBF |
| CY62147DV30LL-70BVI | MoBL® Asynchronous SRAM | Low-power working-memory and retained-data direction for established embedded platforms. | 4 Mbit legacy SRAM context | Organization, speed, voltage, standby current, interface timing, package, temperature, board compatibility, lifecycle, and approved migration. | View CY62147DV30LL-70BVI |
| IPW60R024CFD7 | CoolMOS™ CFD7 MOSFET | Resonant and high-power SMPS direction for server, telecom, industrial, and charging systems. | 600 V TO-247 device context | Full OPN, topology, bus voltage, current, RDS(on), QG, reverse recovery, frequency, gate driver, thermal design, and protection. | View IPW60R024CFD7 |
Use this table for initial direction only. Confirm the complete Infineon ordering code, electrical and thermal attributes, package, qualification, lifecycle, driver or host compatibility, supporting circuit, current manufacturer documentation, and prototype results before design or purchasing approval.
Build a Complete Solution Around the Application.
Each application combines several functions. Review the power stage, controller, memory, interfaces, sensing, security, software, thermal design, and lifecycle together.
Industrial Drives and Robotics
Coordinate IGBT, SiC, or MOSFET switches, isolated gate drivers, current and position sensing, XMC™ or PSOC™ control, protection, cooling, field connectivity, safety, and lifetime.
Energy Conversion and EV Charging
Review PFC, isolated DC-DC, inverter topology, CoolMOS™, CoolSiC™, IGBT modules, drivers, sensing, auxiliary supply, thermal management, grid or vehicle requirements, and protection.
Server and Telecom Power
Match high-voltage PFC and resonant stages with low-voltage synchronous rectification, gate drivers, digital control, current sensing, protection, EMI, cooling, density, and reliability goals.
Automotive Control and Electrification
Connect AURIX™, TRAVEO™, power semiconductors, battery and motor control, OPTIREG™, XENSIV™, memories, networks, and security to the exact ECU and qualification context.
Secure IoT and Smart Products
Balance PSOC™ processing, programmable analog, AIROC™ wireless, memory, XENSIV™ sensors, OPTIGA™ trust, low-power operation, cloud connection, update strategy, and production life.
USB, Memory, and Data Interfaces
Review EZ-USB™, NOR flash, SRAM or F-RAM, density, throughput, voltage, endurance, host driver, firmware, package, temperature, qualification, lifecycle, and replacement strategy.
Turn System Requirements Into an Orderable Infineon Part.
A suitable family is only the start. Before procurement, confirm the complete ordering code, ratings, software compatibility, package, qualification, lifecycle, quantity, source condition, evidence, and delivery timing.
Topology, DC link, current, switching, short circuit, isolation, gate drive, sensing, protection, cooling, mounting, and lifetime.
VDS, current, RDS(on), gate charge, drive voltage, frequency, SOA, transient behavior, package, PCB copper, and thermal path.
Topology, bus voltage, hard or soft switching, losses, reverse recovery, driver, EMI, protection, cooling, package, and qualification.
ECU role, workload, safety, security, networking, memory, sensing, power stage, temperature, qualification, software, and lifecycle.
CPU, analog, timers, interface, wireless, USB, memory, host software, hardware trust, package, power, security, and production life.
Browse Infineon Parts by Product Type.
Filter representative products by power module, MOSFET, memory, or USB interface. Use the search above when you already have an exact OPN.
FF450R12ME4
EconoDUAL™ 3 IGBT-module direction for high-power industrial inverters, motor drives, and energy conversion. Confirm topology, current profile, switching, driver, cooling, mounting, and lifetime.
View FF450R12ME4BSC014N04LS6
Low-voltage high-current MOSFET direction for synchronous rectification and compact power rails. Confirm the complete approved OPN, drive conditions, switching behavior, package, layout, and thermal path.
View BSC014N04LS6S25FL128SAGMFI011
128-Mbit FL-S SPI Multi-I/O NOR flash direction for boot and embedded code storage. Confirm interface modes, voltage, temperature, package, endurance, retention, software, and lifecycle.
View S25FL128SAGMFI011CY7C68013A-56LTXC
Discontinued 56-pin QFN FX2LP USB 2.0 controller for maintenance of released systems. Confirm firmware, host driver, package, remaining-supply evidence, and an engineering-approved migration path.
View CY7C68013A-56LTXC
FP25R12W1T4
Compact EasyPIM™ module direction for motor drives and industrial power conversion. Confirm the rectifier, inverter and brake topology, motor current, switching, driver, protection, cooling, and lifecycle.
View FP25R12W1T4
IRFB7430PBF
40-V TO-220 StrongIRFET™ direction for established low-frequency high-current systems. The official status is not for new design; confirm replacement authority, thermal design, and supply evidence.
View IRFB7430PBF
CY62147DV30LL-70BVI
Legacy MoBL® asynchronous SRAM direction for low-power working memory in released embedded products. Confirm organization, speed, voltage, timing, package, temperature, and migration authority.
View CY62147DV30LL-70BVI
IPW60R024CFD7
600-V TO-247 CoolMOS™ CFD7 direction for resonant and high-power SMPS. Confirm the full orderable code, operating point, reverse recovery, gate driver, EMI, protection, and thermal design.
View IPW60R024CFD7Cannot find the Infineon, Cypress, or IR part number? Send the complete OPN or family, required electrical or system function, package and qualification, quantity, application, driver or software context, target date, destination, approved alternatives, and required evidence.
Review the Exact Part and Evidence Before Shipment.
YURUNOX reviews the quoted Infineon part against the complete OPN, package, qualification, lifecycle, source basis, quantity, terms, and agreed evidence.
Manufacturer, complete OPN, suffix, electrical rating or memory density, package, qualification, quantity, labels, packing, and available traceability.
Current lifecycle information, datasheet and revision context, available PCN or PDN records, driver, firmware or host compatibility, and customer alternate authority.
Packaging and label photos, visual or microscopic condition, marking review, X-ray, electrical or other suitable checks when available and agreed.
Offered quantity, price basis, validity, lead time, payment, freight, date or lot information, exceptions, destination, and receiving requirements.
From Part Number to Purchase Approval.
A complete RFQ makes technical, quality, commercial, and delivery expectations visible before the order moves forward.
CY7C68013A-56LTXC for a Released USB Instrument
The buyer needs the exact 56-pin QFN FX2LP controller for a released instrument. Because the device is discontinued and the firmware and host driver are validated, another controller cannot be accepted without engineering migration work.
Align the Released Platform
Confirm application, exact OPN, package, hardware revision, firmware and host driver, qualification, lifecycle, quantity, required date, and alternate authority.
Review the Offered Supply
Record source basis, offered quantity, condition, packing, available date or lot information, lead time, price basis, validity, and exceptions.
Agree the Evidence
Define label, packaging, visual, microscopic, marking, X-ray, electrical, documentation, or other requirements when suitable and agreed.
Approve Release and Delivery
Review evidence, exceptions, commercial terms, shipping documents, protective packaging, carrier handoff, destination, and tracking.
Infineon Component Sourcing FAQ.
Use these answers to prepare a clearer Infineon ordering-code search, power-stage or MCU review, shortage request, legacy Cypress or IR review, or BOM quotation.
Can YURUNOX source an exact Infineon ordering code?
Send the complete OPN including every suffix, required quantity, target date, destination, voltage or memory attributes, package, temperature or qualification context, packing preference, and any date-code, lot, traceability, inspection, or documentation requirements. Availability and terms are confirmed for the actual RFQ.
What information is needed for an Infineon power-device review?
Provide the topology, bus voltage, continuous and peak current, switching frequency, hard or soft switching, overload and short-circuit requirements, gate drive, isolation, losses, cooling, mechanical constraints, qualification, lifecycle, and production quantity.
How do MOSFET, IGBT, SiC, and GaN directions differ?
The suitable technology depends on voltage, current, frequency, switching topology, conduction and switching losses, reverse-recovery behavior, gate drive, thermal design, reliability, cost, and qualification. Select the complete power stage rather than choosing only by voltage or current.
How do AURIX™, TRAVEO™, XMC™, and PSOC™ directions differ?
AURIX™ targets demanding automotive and industrial real-time safety and security, TRAVEO™ focuses on automotive body and HMI control, XMC™ addresses industrial control and power conversion, and PSOC™ provides programmable embedded-control platforms for industrial, consumer, IoT, and automotive use.
How do I avoid ordering the wrong Infineon suffix or package?
Use the complete orderable part number from the approved BOM or current manufacturer documentation. Confirm voltage or density, technology, package, packing method, temperature, qualification, revision, lifecycle, and replacement context rather than matching only the base family.
What happens if the requested Infineon component is discontinued or not recommended for new design?
The review can separate available legacy supply, split quantity, revised timing, another packing option, a manufacturer-listed replacement, or an engineering migration path. No replacement is treated as approved until the customer validates the circuit, thermal design, mechanics, firmware, drivers, compliance, and purchasing impact.
Can I submit Cypress, International Rectifier, and Infineon codes in one BOM?
Yes. Include the manufacturer shown on the approved BOM, complete OPN, quantity, target date, destination, approved alternatives, application notes, electrical or software context, package or qualification, and required evidence for each line.
What quality evidence can be requested before shipment?
Depending on the part, supply condition, quantity, risk, samples, equipment, available records, and agreed scope, evidence may include packaging and label photos, visual or microscopic inspection, marking review, X-ray, electrical checks, and supporting documents.
Send Your Infineon Part Number, BOM, or System Requirement.
Include the system function, electrical and thermal limits, preferred OPN or BOM, package and qualification context, software baseline, quantity, target date, destination, approved alternatives, and evidence requirements.