XC6SLX9-2FTG256C

XC6SLX9-2FTG256C

Premium Xilinx XC6SLX9-2FTG256C is a high-performance, cost-optimized Spartan-6 FPGA chip housed in a FTGB256 package. Featuring 9,152 logic cells, a 576 Kbits embedded memory matrix, and 186 available user I/O ports, this versatile programmable logic device delivers deterministic timing control required for legacy industrial automation, interface bridging, and telecommunications.

Info Product

SKU: XC6SLX9-2FTG256C 品牌:

描述

XC6SLX9-2FTG256C Spartan-6 FPGA

Optimized Cost-Efficiency meets Power Minimization – The Professional Spartan-6 LX FPGA Choice for Streamlined Signal Bridging & Logic Co-Processing.

// AMD Xilinx Original Factory Sealed Allocation
// High-Efficiency 9.1K Logic Cells Programmable Fabric Portfolio

The Spartan-6 Architectural Advantage

The XC6SLX9-2FTG256C represents a premier solution for high-volume, power-conscious, and cost-optimized hardware layout designs. Engineered by AMD Xilinx on a mature, low-power 45-nm copper silicon process, this Spartan-6 LX FPGA offers 9,152 flexible logic cells paired with a 576 Kbits internal block RAM matrix. Housed in a dense, fine-pitch FTGB256 package footprint, it delivers exceptional parallel processing throughput across 186 configurable user I/O ports, successfully preventing interface bottlenecks inside telecommunication routers, custom PCI interfaces, and factory automation boards.

  • 9,152 High-efficiency Logic Cells (LEs) for custom hardware logic mapping
  • 186 Configurable User I/O pins supporting independent multi-voltage rail drive
  • On-chip digital clock managers (DCMs) and phase-locked loops (PLLs) for absolute timing sync

XC6SLX9-2FTG256C

Key Performance Advantages

Advanced Power Efficiency

Built on a low-power 45-nm dual-oxide process node, minimizing static and dynamic power drain while effectively capping localized logic board heat generation.

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576Kb Block RAM Matrix

Houses dense integrated memory blocks that allow smooth dual-port FIFO data buffering, custom parameters caching, and deterministic execution speeds.

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High Pin-to-Logic Ratio

Expands external interface capabilities with 186 user-configurable I/O pins, backed by multi-frequency global clock loops to stabilize wide bus interactions.

Technical Specifications

Parameter Node Detailed Engineering Specification
Manufacturer AMD Xilinx
Part Number (MPN) XC6SLX9-2FTG256C
Device Family Spartan-6 LX FPGA Architecture Series
Logic Cells / Elements 9,152 Logic Elements
Total Embedded RAM 576 Kbits (576 KB Internal Block RAM Matrix)
Number of LABs / CLBs 715 Logic Array Blocks
Number of User I/Os 186 Configurable User I/O Ports
Package / Case Form FTBGA-256 / FTG256 Footprint (Fine-Pitch Ball Grid Array Package, 17mm x 17mm)
Speed Grade Designation -2 Speed Optimization Grade
Temperature Window 0°C to +85°C Commercial Operational Spectrum Compliance

Versatile Hardware Applications

  • Industrial Automation: Runs real-time motor synchronization loops, sensor hub data harvesting, and automated PLC modules.
  • Interface Signal Bridging: Ideal for custom PCI/PCIe expansions, micro-display deserializers, and video format level-shifting.
  • Telecommunications Workstations: Handles clean packet data framing, serial protocol conversions, and peripheral multiplexing lines.
  • System Logic Consolidation: Cleanly integrates discrete microcontrollers and hardware logic blocks onto a single secure platform.

Industrial Quality Protections

100% Original Sourcing: Procured securely through fully audited tier-1 franchise lines, completely ensuring anti-counterfeit protection.

Anti-Static Handling: Stored and picked in full alignment with international ANSI/ESD cleanroom facility benchmarks.

Full Batch Traceability: Verified via intensive certificate analysis and rigorous documentation tracking prior to export dispatch.

HIGH-PERFORMANCE PROGRAMMABLE LOGIC SOLUTIONS // DIRECT SOURCE ARCHITECTURE

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