Description
CYW20719B2KUMLG Bluetooth System-on-Chip
CYW20719B2KUMLG is a Bluetooth System-on-Chip from Infineon Technologies. It is listed here to support exact-part identification, manufacturer-reference review and order-specific sourcing. Confirm the complete ordering code, package, lifecycle status, required evidence and application conditions before purchase.
Product Identity and Selection Context
CYW20719B2KUMLG is a Bluetooth System-on-Chip from Infineon Technologies. It is listed here to support exact-part identification, manufacturer-reference review and order-specific sourcing. Confirm the complete ordering code, package, lifecycle status, required evidence and application conditions before purchase. Final suitability depends on the complete circuit, software, thermal, mechanical, qualification and lifecycle requirements.
- Component Type: Bluetooth System-on-Chip
- Frequency: Hopping (AFH)
- Interface: device (HID) applications. Manufactured using an advanced 40nm CMOS low-power fabrication process, the CYW20719 employs high level of integration to reduce external compo
Key Selection Characteristics
Component Type: Bluetooth System-on-Chip
Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements.
Frequency: Hopping (AFH)
Confirm this performance or interface point against timing, throughput, protocol and system-level margin.
Interface: device (HID) applications. Manufactured using an advanced 40nm CMOS low-power fabrication process, the CYW20719 employs high level of integration to reduce external compo
Confirm this performance or interface point against timing, throughput, protocol and system-level margin.
Verified Identification Details
| Parameter | Reference Detail |
|---|---|
| Manufacturer | Infineon Technologies |
| Part Number (MPN) | CYW20719B2KUMLG |
| Component Type | Bluetooth System-on-Chip |
| Frequency | Hopping (AFH) |
| Interface | device (HID) applications. Manufactured using an advanced 40nm CMOS low-power fabrication process, the CYW20719 employs high level of integration to reduce external compo |
| Package / Packing | Confirm exact package, suffix and packing format |
| Lifecycle / Status | Current manufacturer lifecycle confirmation required |
Typical Application Directions
- Embedded control and computing platforms — review the complete interface, load, environment, qualification and lifecycle conditions for the target system.
- Industrial, automotive or connected equipment — review the complete interface, load, environment, qualification and lifecycle conditions for the target system.
- Maintenance and lifecycle support for established designs — review the complete interface, load, environment, qualification and lifecycle conditions for the target system.
Order-Specific Procurement Review
Exact identity: Confirm the full manufacturer part number, suffix, package, grade, packing format and acceptable alternatives.
Inspection evidence: Agree label, packaging, visual, traceability or additional test evidence before release.
Commercial and delivery: Review quantity, source condition, date or lot information, lead time, destination and shipping documents.
Send CYW20719B2KUMLG, quantity, target date, destination and evidence requirements.
Technical reference: manufacturer product page or official document.
Confirm the latest manufacturer documentation, complete ordering code and application requirements before design release or purchase.
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