Description
EFR32BG27C140F768IM32-BR Bluetooth Low Energy System-on-Chip
EFR32BG27C140F768IM32-BR is a Bluetooth Low Energy System-on-Chip from Silicon Labs. This page organizes the key identity, selection and sourcing details so engineering and procurement teams can compare the exact orderable code with the actual system and order requirements.
What Does EFR32BG27C140F768IM32-BR Do?
As a bluetooth low energy system-on-chip, EFR32BG27C140F768IM32-BR supports embedded control and computing platforms. Selection should be based on the exact electrical or functional limits, interfaces, package, environment and lifecycle needs of the target system—not on a family name alone.
Manufacturer: Silicon Labs
Exact MPN: EFR32BG27C140F768IM32-BR
Component type: Bluetooth Low Energy System-on-Chip
Package / packing: 32-VFQFN Exposed Pad; 32-QFN (4×4); 32-QFN (4×4)
Lifecycle: Active / Production
Selection starts with the full orderable code
Confirm the manufacturer, base device, package, speed or grade, temperature or qualification class, packing suffix and approved alternatives. Small suffix differences can change assembly, electrical or lifecycle fit.
Key Selection Characteristics
Technical Specifications and Buyer Relevance
| Parameter | Reference Detail | Why It Matters |
|---|---|---|
| Manufacturer | Silicon Labs | Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements. |
| Part Number (MPN) | EFR32BG27C140F768IM32-BR | Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements. |
| Component Type | Bluetooth Low Energy System-on-Chip | Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements. |
| Wireless Standard | Bluetooth Low Energy | Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements. |
| Flash Memory | 768 kB | Use this architecture detail to check processing, storage, conversion or channel requirements for the target design. |
| RAM | 64 kB class | Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements. |
| Package | 32-pin QFN | Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements. |
| Package / Packing | 32-VFQFN Exposed Pad; 32-QFN (4×4); 32-QFN (4×4) | Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements. |
| Lifecycle / Status | Active / Production | Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements. |
Is EFR32BG27C140F768IM32-BR Suitable for Your Design?
It may be suitable when its verified electrical, performance, interface and package characteristics match the system requirement with appropriate engineering margin. Review the complete circuit, thermal, mechanical, software, qualification and regulatory context before approving the exact orderable code.
For a replacement or shortage request, compare the original part and any proposed alternative field by field. A functionally similar component is not automatically pin-, software- or qualification-compatible.
Typical Applications
- Embedded control and computing platforms
- Industrial, automotive or connected equipment
- Maintenance and lifecycle support for established designs
What Buyers Should Provide
- Exact MPN, manufacturer and acceptable alternatives
- Required quantity, target date and destination
- Package, grade, date or lot and packing requirements
- Inspection, traceability and document expectations
- Application constraints that affect suitability
Order-Specific Sourcing Guidance
Identity and condition: Review the exact suffix, manufacturer marking, source basis, offered condition and packing before commercial approval.
Evidence and release: Agree available labels, photos, traceability, visual inspection or additional testing evidence before shipment.
Delivery: Confirm quantity, lead time basis, protective packing, documents, destination, carrier handoff and tracking.
Send your EFR32BG27C140F768IM32-BR quantity, target date, destination and inspection requirements.We will review the exact part, offered condition, packaging, available evidence and delivery terms.
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