Description
THGBMUG6C1LBAIL NAND Flash Memory
THGBMUG6C1LBAIL is a NAND Flash Memory from Toshiba. Review the exact orderable code, package, key characteristics and application fit before approving the sourcing requirement.
What Does THGBMUG6C1LBAIL Do?
As a NAND Flash Memory, THGBMUG6C1LBAIL provides volatile or nonvolatile data storage for embedded, computing and industrial systems. Selection should be based on the exact electrical or functional limits, interfaces, package, operating environment and lifecycle needs of the target system—not on a family name alone.
Manufacturer: Toshiba
Exact MPN: THGBMUG6C1LBAIL
Component type: NAND Flash Memory
Package / packing: 153-WBGA; 153-BGA (11.5×13); 153-BGA (11.5×13)
Lifecycle: Order-specific lifecycle review
Selection starts with the full orderable code
Confirm the manufacturer, base device, package, speed or grade, temperature or qualification class, packing suffix and approved alternatives. Small suffix differences can change assembly, electrical or lifecycle fit.
Key Selection Characteristics
Technical Specifications and Buyer Relevance
| Parameter | Reference Detail | Why It Matters |
|---|---|---|
| Manufacturer | Toshiba | Compare this detail with the complete electrical, mechanical, software and lifecycle requirement. |
| Part Number (MPN) | THGBMUG6C1LBAIL | Compare this detail with the complete electrical, mechanical, software and lifecycle requirement. |
| Component Type | NAND Flash Memory | Compare this detail with the complete electrical, mechanical, software and lifecycle requirement. |
| Memory Size | 64Gbit | Confirm this electrical or performance point against system margin, timing, protocol and software requirements. |
| Frequency | 200 MHz | Confirm this electrical or performance point against system margin, timing, protocol and software requirements. |
| Supply Voltage | 2.7V ~ 3.6V | Confirm this electrical or performance point against system margin, timing, protocol and software requirements. |
| Operating Temperature | 25°C ~ 85°C | Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements. |
| Interface | eMMC_5.1 | Confirm this electrical or performance point against system margin, timing, protocol and software requirements. |
| Package / Packing | 153-WBGA; 153-BGA (11.5×13); 153-BGA (11.5×13) | Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements. |
| Lifecycle / Status | Order-specific lifecycle review | Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements. |
Is THGBMUG6C1LBAIL Suitable for Your Design?
It may be suitable when its verified electrical, performance, interface and package characteristics match the system requirement with appropriate engineering margin. Review the complete circuit, thermal, mechanical, software, qualification and regulatory context before approving the exact orderable code.
For a replacement or shortage request, compare the original part and any proposed alternative field by field. A functionally similar component is not automatically pin-, software- or qualification-compatible.
Typical Applications
- System memory and embedded storage
- Boot, logging and data-retention functions
- Capacity, speed-grade and package-constrained replacements
What Buyers Should Provide
- Exact MPN, manufacturer and acceptable alternatives
- Required quantity, target date and destination
- Package, grade, date or lot and packing requirements
- Inspection, traceability and document expectations
- Application constraints that affect suitability
Order-Specific Sourcing Guidance
Identity and condition: Review the exact suffix, manufacturer marking, source basis, offered condition and packing before commercial approval.
Evidence and release: Agree available labels, photos, traceability, visual inspection or additional testing evidence before shipment.
Delivery: Confirm quantity, lead time basis, protective packing, documents, destination, carrier handoff and tracking.
Send your THGBMUG6C1LBAIL quantity, target date, destination and inspection requirements.We will review the exact part, offered condition, packaging, available evidence and delivery terms.
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