XCKU3P-1FFVB676I (Kintex UltraScale+ FPGA)

XCKU3P-1FFVB676I is a Kintex UltraScale+ FPGA from AMD. Review the exact MPN, package, key parameters and application fit, then request an order-specific sourcing check covering quantity, condition, lifecycle, inspection evidence and delivery terms.

Info Product

SKU: XCKU3P-1FFVB676I Category: Brand:

Description

AMD · Exact Part Review

XCKU3P-1FFVB676I Kintex UltraScale+ FPGA

XCKU3P-1FFVB676I is a Kintex UltraScale+ FPGA from AMD. This page organizes the key identity, selection and sourcing details so engineering and procurement teams can compare the exact orderable code with the actual system and order requirements.

Manufacturer: AMDMPN: XCKU3P-1FFVB676IStatus: Active / Production

What Does XCKU3P-1FFVB676I Do?

As a kintex ultrascale+ fpga, XCKU3P-1FFVB676I supports programmable logic, acceleration and interface control. Selection should be based on the exact electrical or functional limits, interfaces, package, environment and lifecycle needs of the target system—not on a family name alone.

Product identity panel

Manufacturer: AMD

Exact MPN: XCKU3P-1FFVB676I

Component type: Kintex UltraScale+ FPGA

Package / packing: 676-BBGA, FCBGA; 676-FCBGA (27×27); 676-FCBGA (27×27)

Lifecycle: Active / Production

Selection starts with the full orderable code

Confirm the manufacturer, base device, package, speed or grade, temperature or qualification class, packing suffix and approved alternatives. Small suffix differences can change assembly, electrical or lifecycle fit.

Key Selection Characteristics

01Product FamilyKintex UltraScale+
02Device TypeField-programmable gate array
03Temperature GradeIndustrial
04PackageFFVB676

Technical Specifications and Buyer Relevance

Parameter Reference Detail Why It Matters
Manufacturer AMD Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements.
Part Number (MPN) XCKU3P-1FFVB676I Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements.
Component Type Kintex UltraScale+ FPGA Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements.
Product Family Kintex UltraScale+ Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements.
Device Type Field-programmable gate array Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements.
Temperature Grade Industrial Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements.
Package FFVB676 Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements.
Package / Packing 676-BBGA, FCBGA; 676-FCBGA (27×27); 676-FCBGA (27×27) Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements.
Lifecycle / Status Active / Production Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements.

Is XCKU3P-1FFVB676I Suitable for Your Design?

It may be suitable when its verified electrical, performance, interface and package characteristics match the system requirement with appropriate engineering margin. Review the complete circuit, thermal, mechanical, software, qualification and regulatory context before approving the exact orderable code.

For a replacement or shortage request, compare the original part and any proposed alternative field by field. A functionally similar component is not automatically pin-, software- or qualification-compatible.

Typical Applications

  • Programmable logic, acceleration and interface control
  • Embedded vision, networking and industrial computing
  • Legacy board support and exact package migration reviews

What Buyers Should Provide

  • Exact MPN, manufacturer and acceptable alternatives
  • Required quantity, target date and destination
  • Package, grade, date or lot and packing requirements
  • Inspection, traceability and document expectations
  • Application constraints that affect suitability

Order-Specific Sourcing Guidance

Identity and condition: Review the exact suffix, manufacturer marking, source basis, offered condition and packing before commercial approval.

Evidence and release: Agree available labels, photos, traceability, visual inspection or additional testing evidence before shipment.

Delivery: Confirm quantity, lead time basis, protective packing, documents, destination, carrier handoff and tracking.

Request an order-specific review

Send your XCKU3P-1FFVB676I quantity, target date, destination and inspection requirements.We will review the exact part, offered condition, packaging, available evidence and delivery terms.

Request XCKU3P-1FFVB676I Quote→

Technical references

Product / source reference

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