Description
XCZU4CG-1SFVC784E Zynq UltraScale+ MPSoC
XCZU4CG-1SFVC784E is a Zynq UltraScale+ MPSoC from AMD. This page organizes the key identity, selection and sourcing details so engineering and procurement teams can compare the exact orderable code with the actual system and order requirements.
What Does XCZU4CG-1SFVC784E Do?
As a zynq ultrascale+ mpsoc, XCZU4CG-1SFVC784E supports embedded control and computing platforms. Selection should be based on the exact electrical or functional limits, interfaces, package, environment and lifecycle needs of the target system—not on a family name alone.
Manufacturer: AMD
Exact MPN: XCZU4CG-1SFVC784E
Component type: Zynq UltraScale+ MPSoC
Package / packing: SFVC784
Lifecycle: Order-specific lifecycle review
Selection starts with the full orderable code
Confirm the manufacturer, base device, package, speed or grade, temperature or qualification class, packing suffix and approved alternatives. Small suffix differences can change assembly, electrical or lifecycle fit.
Key Selection Characteristics
Technical Specifications and Buyer Relevance
| Parameter | Reference Detail | Why It Matters |
|---|---|---|
| Manufacturer | AMD | Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements. |
| Part Number (MPN) | XCZU4CG-1SFVC784E | Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements. |
| Component Type | Zynq UltraScale+ MPSoC | Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements. |
| Product Family | Zynq UltraScale+ | Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements. |
| Device Type | Multiprocessor system-on-chip | Review this identification detail with the complete electrical, mechanical, software and lifecycle requirements. |
| Speed Grade | -1 | Confirm this performance or interface point against timing, throughput, protocol and system-level margin. |
| Package | SFVC784 | Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements. |
| Package / Packing | SFVC784 | Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements. |
| Lifecycle / Status | Order-specific lifecycle review | Confirm this physical, environmental or lifecycle condition against assembly, handling and order requirements. |
Is XCZU4CG-1SFVC784E Suitable for Your Design?
It may be suitable when its verified electrical, performance, interface and package characteristics match the system requirement with appropriate engineering margin. Review the complete circuit, thermal, mechanical, software, qualification and regulatory context before approving the exact orderable code.
For a replacement or shortage request, compare the original part and any proposed alternative field by field. A functionally similar component is not automatically pin-, software- or qualification-compatible.
Typical Applications
- Embedded control and computing platforms
- Industrial, automotive or connected equipment
- Maintenance and lifecycle support for established designs
What Buyers Should Provide
- Exact MPN, manufacturer and acceptable alternatives
- Required quantity, target date and destination
- Package, grade, date or lot and packing requirements
- Inspection, traceability and document expectations
- Application constraints that affect suitability
Order-Specific Sourcing Guidance
Identity and condition: Review the exact suffix, manufacturer marking, source basis, offered condition and packing before commercial approval.
Evidence and release: Agree available labels, photos, traceability, visual inspection or additional testing evidence before shipment.
Delivery: Confirm quantity, lead time basis, protective packing, documents, destination, carrier handoff and tracking.
Send your XCZU4CG-1SFVC784E quantity, target date, destination and inspection requirements.We will review the exact part, offered condition, packaging, available evidence and delivery terms.
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